Taichung, Taiwan – Winbond Electronics Corporation announced the enhanced LPDDR4/4X DRAM products, specifically designed for the latest generation of automotive applications. These solutions are designed to offer significant advancements in power efficiency, performance, and carbon reduction.

Taichung, Taiwan – Winbond Electronics Corporation unveiled the W25N01KW, a 1Gb 1.8V QspiNAND flash solution designed to meet the demands of wearable and battery-operated IoT devices with low standby power, small-form-factor package, and continuous read for fast boot and instant-on support.

In a recent IoT Analytics Research report, the IoT semiconductor market is set to grow from $33 billion (in 2020) to $80 billion by 2025, with the four fastest growing fields being IoT microcontrollers (MCUs), IoT connectivity chipsets, IoT AI chipsets, and IoT security chipsets and modules to achieve better performance and lower power in applications such as smart watches, automotive, and smart homes.

Another trade show is in the books, and I’m pleased to report things are about as back to normal as they are likely to get. The show I’m referring to is electronica, which is held bi-annually in Munich, Germany. As such, it’s been four years since we’ve convened at what it is generally considered the world’s largest event for the embedded and electronics industries.

Everyone will agree how important high-quality, high-reliability, and low-latency Flash Memory is for AI chips and applications. Finding the right balance of performance, power consumption, security, reliability, high efficiency for different applications is crucial. Cost, although important, should not be the most important consideration.

Winbond Electronics Corporation announced significant enhancements to its DDR3 product on the ultra-high-speed performance.

Winbond Electronics Corporation, together with Infineon Technologies, has announced the expansion of their HYPERRAM product collaboration with the new higher bandwidth HYPERRAM 3.0.